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SEMICONDUCTOR WAFER BONDING

621.38152 / T613S
Tong,Q. Y.
SEMICONDUCTOR WAFER BONDING / .- John Wiley, New York, 1999 .- xviii,297 .
Includes Index
ISBN: 0471574813
Subject Headings:
Semiconductors -- Bonding;
Semiconductor Wafers;
Author Added Entry:
Gosele,U.;
Copy Details:
Acc. No.: A128875, Full Call No.: 621.38152 T613S, Item type: Books , Location: General Stacks,
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SEMICONDUCTOR WAFER BONDING