Advanced polyimide materials (Record no. 559377)
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000 -LEADER | |
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fixed length control field | 02007 a2200205 4500 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20180904160659.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 180829b xxu||||| |||| 00| 0 eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
ISBN | 9780128126400 |
040 ## - CATALOGING SOURCE | |
Transcribing agency | IIT Kanpur |
041 ## - LANGUAGE CODE | |
Language code of text/sound track or separate title | eng |
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 668.9 |
Item number | Ad95 |
245 ## - TITLE STATEMENT | |
Title | Advanced polyimide materials |
Remainder of title | synthesis, characterization and applications |
Statement of responsibility, etc | edited by Shi-Yong Yang |
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
Name of publisher | Elsevier |
Year of publication | 2018 |
Place of publication | Amsterdam |
300 ## - PHYSICAL DESCRIPTION | |
Number of Pages | xiv, 483p |
440 ## - SERIES STATEMENT/ADDED ENTRY--TITLE | |
Title | A chemical industry press series on advanced electronic packaging technology and key materials / edited by C. P. Wong and Wenhui Zhu |
520 ## - SUMMARY, ETC. | |
Summary, etc | Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.<br/><br/>The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.<br/><br/><br/> Reviews the latest research, development and future prospective of polyimides<br/> Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers<br/> Presents a highly organized work that is composed of different sections that are easily compared |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical Term | Polymer science |
700 ## - ADDED ENTRY--PERSONAL NAME | |
Personal name | Yang, Shi-Yong [ed.] |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Books |
Withdrawn status | Lost status | Damaged status | Not for loan | Collection code | Home library | Current library | Date acquired | Source of acquisition | Cost, normal purchase price | Full call number | Accession Number | Cost, replacement price | Koha item type |
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General Stacks | PK Kelkar Library, IIT Kanpur | PK Kelkar Library, IIT Kanpur | 27/08/2018 | 2 | 11161.60 | 668.9 Ad95 | A183731 | 13952.00 | Books |