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Three dimensional system integration : IC stacking process and design

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Contributor(s): Material type: TextTextPublication details: New York Springer 2011Description: viii, 246pISBN:
  • 9781441909619
Subject(s): DDC classification:
  • 006.693 T413
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Holdings
Item type Current library Collection Call number URL Status Date due Barcode Item holds
Books Books PK Kelkar Library, IIT Kanpur COMPACT STORAGE (BASEMENT) 006.693 T413 (Browse shelf(Opens below)) Link to resource Available A172030
Total holds: 0
Browsing PK Kelkar Library, IIT Kanpur shelves, Collection: COMPACT STORAGE (BASEMENT) Close shelf browser (Hides shelf browser)
006.693 M919 Multi-dimensional imaging 006.693 P442s Subdivision surfaces 006.693 T413 3D imaging for safety and security 006.693 T413 Three dimensional system integration 006.693 V889C VOLUME GRAPHICS 006.693 W69m2 3D modeling in AutoCAD 006.693015158 Im7 Implicit curves and surfaces

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