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Wire bonding in microelectronics

By: Material type: TextTextPublication details: New York Mcgraw-Hill 2010Edition: 3rdDescription: xx, 426pISBN:
  • 9780071476232
Subject(s): DDC classification:
  • 621.3815 H227w3
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Holdings
Item type Current library Collection Call number URL Status Date due Barcode Item holds
Books Books PK Kelkar Library, IIT Kanpur COMPACT STORAGE (BASEMENT) 621.3815 H227w3 (Browse shelf(Opens below)) Link to resource Available A172371
Total holds: 0

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