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Encyclopedia of thermal packaging [4 volume set] : a guide to cooling of electronic equipment: thermal packaging tools
Material type:
TextLanguage: English Publication details: New Jersey World Scientific 2012Description: various pagingsISBN: - 9789814327602
- 621.381046 En19
Contents:
Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components.
| Item type | Current library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds | |
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Reference
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PK Kelkar Library, IIT Kanpur | Reference | 621.381046 En19 v.1 (Browse shelf(Opens below)) | v.1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research | Reference | A180823 | |||
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Reference
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PK Kelkar Library, IIT Kanpur | Reference | 621.381046 En19 v.2 (Browse shelf(Opens below)) | v.2. Energy optimization and thermal management of data centres | Reference | A180824 | |||
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Reference
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PK Kelkar Library, IIT Kanpur | Reference | 621.381046 En19 v.3 (Browse shelf(Opens below)) | v.3. Compact thermal models of electronic components | Reference | A180825 | |||
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Reference
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PK Kelkar Library, IIT Kanpur | Reference | 621.381046 En19v.4 (Browse shelf(Opens below)) | v.4. Thermally-Informed design of microelectronic components. | Reference | A180826 |
Total holds: 0
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| 621.381046 En19 v.4 Encyclopedia of thermal packaging [6 volume set] | 621.381046 En19 v.5 Encyclopedia of thermal packaging [6 volume set] | 621.381046 En19 v.6 Encyclopedia of thermal packaging [6 volume set] | 621.381046 En19v.4 Encyclopedia of thermal packaging [4 volume set] | 621.38132 R339g2 v.1 cop.1 The RF and microwave handbook [3 volume set] | 621.38132 R339g2 v.1 cop.2 The RF and microwave handbook [3 volume set] | 621.38132 R339g2 v.2 The RF and microwave handbook [3 volume set] |
Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components.
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