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Encyclopedia of thermal packaging [4 volume set] : a guide to cooling of electronic equipment: thermal packaging tools

Contributor(s): Material type: TextTextLanguage: English Publication details: New Jersey World Scientific 2012Description: various pagingsISBN:
  • 9789814327602
Subject(s): DDC classification:
  • 621.381046 En19
Contents:
Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components.
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Holdings
Item type Current library Collection Call number Vol info Status Date due Barcode Item holds
Reference Reference PK Kelkar Library, IIT Kanpur Reference 621.381046 En19 v.1 (Browse shelf(Opens below)) v.1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research Reference A180823
Reference Reference PK Kelkar Library, IIT Kanpur Reference 621.381046 En19 v.2 (Browse shelf(Opens below)) v.2. Energy optimization and thermal management of data centres Reference A180824
Reference Reference PK Kelkar Library, IIT Kanpur Reference 621.381046 En19 v.3 (Browse shelf(Opens below)) v.3. Compact thermal models of electronic components Reference A180825
Reference Reference PK Kelkar Library, IIT Kanpur Reference 621.381046 En19v.4 (Browse shelf(Opens below)) v.4. Thermally-Informed design of microelectronic components. Reference A180826
Total holds: 0

Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components.

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