Image from Amazon.com
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Material type:
TextPublication details: New Jersey John Wiley & Sons 2012Description: xiv, 366pISBN: - 9780470623466
- 621.3815 L612e
| Item type | Current library | Collection | Call number | URL | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|---|
Books
|
PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.3815 L612e (Browse shelf(Opens below)) | Link to resource | Available | A176030 |
Total holds: 0
Browsing PK Kelkar Library, IIT Kanpur shelves, Collection: COMPACT STORAGE (BASEMENT) Close shelf browser (Hides shelf browser)
| No cover image available | No cover image available | No cover image available |
|
|
No cover image available | No cover image available | ||
| 621.3815 K868c COOLING ELECTRONIC EQUIPMENT | 621.3815 L465t TRANSISTOR CIRCUIT MEASUREMENTS | 621.3815 L578p PRINCIPLES OF SOLID-STATE MICROELECTRONIC | 621.3815 L612e Electrical modeling and design for 3D system integration | 621.3815 L628d Design for high performance, low power, and reliable 3D integrated circuits | 621.3815 L644f FUNDAMENTALS OF SEMICONDUCTOR DEVICES | 621.3815 L644f FUNDAMENTALS OF SEMICONDUCTOR DEVICES |
There are no comments on this title.
Log in to your account to post a comment.