ELECTRONIC PACKAGING WITH RESINS
Material type:
TextSeries: Westinghouse Mcgraw-Hill Engineering Books For Industry ; Publication details: N. Y. Mcgraw-Hill 1961Description: 339DDC classification: - 621.381 H231e
| Item type | Current library | Collection | Call number | URL | Status | Date due | Barcode | Item holds | |
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Books
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381 H231e (Browse shelf(Opens below)) | Link to resource | Available | 21745 |
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| 621.381 H191 HANDBOOK FOR ELECTRONICS ENGINEERING TECHNICIANS | 621.381 H192K SPRINGER HANDBOOK OF ELECTRONIC AND PHOTONIC MATERIALS | 621.381 H231e ELECTRONIC PACKAGING WITH RESINS | 621.381 H231e ELECTRONIC PACKAGING WITH RESINS | 621.381 H231e ELECTRONIC PACKAGING WITH RESINS | 621.381 H231e ELECTRONIC PACKAGING WITH RESINS | 621.381 H231e ELECTRONIC PACKAGING WITH RESINS |
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