TY  - BOOK
AU  - 
AU  - Mahieu, S.,Ed.
TI  - Reactive sputter deposition
SN  - 9783540766629
U1  - 621.38152 
PY  - 2008///
CY  - Berlin
PB  - Springer
KW  - Cathode Sputtering (Plating Process)
ER  -