TY  - BOOK
AU  - Bar-Cohen, Avram [ed.]
TI  - Encyclopedia of thermal packaging [6 volume set]: thermal packaging techinques
SN  - 9789814313780 [set 1]
U1  - 621.381046 
PY  - 2013///
CY  - New Jersey
PB  - World Scientific World
KW  - Insulation (Heat)
KW  - Electronic packaging
N1  - Contents:v.1. Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian -- v. 2. Air- and liquid-cooled cold plates / Allan Kraus -- v. 3. Dielectric liquid cooling of immersed components / Karl J. L. Geisler. Avram Bar-Cohen -- v. 4. Thermoelectric microcoolers / Bao Yang, Peng Wang -- v. 5. Energy efficienct solid state lighting / Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- v. 6. Experimental thermofluid characterization of electronic components / Gary L. Solbrekken
ER  -