TY  - BOOK
AU  - Bar-Cohen, Avram [ed.]
TI  - Encyclopedia of thermal packaging [4 volume set]: a guide to cooling of electronic equipment: thermal packaging tools
SN  - 9789814327602
U1  - 621.381046 
PY  - 2012///
CY  - New Jersey
PB  - World Scientific
KW  - Insulation (Heat)
KW  - Electronic packaging
N1  - Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research --  v. 2. Energy optimization and thermal management of data centres --  v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components
ER  -