TY  - BOOK
AU  - Wu, Banqiu
AU  - Kumar, Ajay
TI  - 3D IC stacking technology
SN  - 9780071741958
U1  - 621.38153 
PY  - 2011///
CY  - New York
PB  - Mcgraw-Hill
KW  - Three-dimensional integrated circuits
KW  - Microelectronic packaging
ER  -