| 000 | 00498pam a2200193a 44500 | ||
|---|---|---|---|
| 008 | 160408b1999 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a0471574813 | ||
| 082 |
_a621.38152 _bT613S |
||
| 100 | _aTong,Q. Y. | ||
| 245 | 1 | _aSEMICONDUCTOR WAFER BONDING | |
| 260 |
_a _bJohn Wiley, New York _c1999 |
||
| 300 | _axviii,297 | ||
| 500 | _aIncludes Index | ||
| 650 | _aSemiconductors -- Bonding | ||
| 650 | _aSemiconductor Wafers | ||
| 700 | _aGosele,U. | ||
| 964 | _gCIRC | ||
| 997 | _aA128875 C | ||
| 999 |
_c332237 _d332237 |
||