| 000 | 01145pam a2200205a 44500 | ||
|---|---|---|---|
| 005 | 20181113122429.0 | ||
| 008 | 160408b2013 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a9789814313780 [set 1] | ||
| 040 | _cIIT Kanpur | ||
| 041 | _aeng | ||
| 082 |
_a621.381046 _bEn19 |
||
| 245 | 1 |
_aEncyclopedia of thermal packaging [6 volume set] _bthermal packaging techinques _cedited by Avram Bar-Cohen |
|
| 260 |
_aNew Jersey _bWorld Scientific World _c2013 |
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| 300 | _avarious pagings | ||
| 505 | _aContents:v.1. Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian -- v. 2. Air- and liquid-cooled cold plates / Allan Kraus -- v. 3. Dielectric liquid cooling of immersed components / Karl J. L. Geisler. Avram Bar-Cohen -- v. 4. Thermoelectric microcoolers / Bao Yang, Peng Wang -- v. 5. Energy efficienct solid state lighting / Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- v. 6. Experimental thermofluid characterization of electronic components / Gary L. Solbrekken. | ||
| 650 | _aInsulation (Heat) | ||
| 650 | _aElectronic packaging | ||
| 700 | _aBar-Cohen, Avram [ed.] | ||
| 942 | _cREF | ||
| 999 |
_c370289 _d370289 |
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