000			02007 a2200205 4500
005			20180904160659.0
008			180829b xxu||||| |||| 00| 0 eng d
020			_a9780128126400
040			_cIIT Kanpur
041			_aeng
082			_a668.9 _bAd95
245			_aAdvanced polyimide materials _bsynthesis, characterization and applications _cedited by Shi-Yong Yang
260			_bElsevier _c2018 _aAmsterdam
300			_axiv, 483p
440			_aA chemical industry press series on advanced electronic packaging technology and key materials / edited by C. P. Wong and Wenhui Zhu
520			_aAdvanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared
650			_aPolymer science
700			_aYang, Shi-Yong [ed.]
942			_cBK
999			_c559377 _d559377