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Advanced polyimide materials : synthesis, characterization and applications

Contributor(s): Language: English Series: A chemical industry press series on advanced electronic packaging technology and key materials / edited by C. P. Wong and Wenhui ZhuPublication details: Elsevier 2018 AmsterdamDescription: xiv, 483pISBN:
  • 9780128126400
Subject(s): DDC classification:
  • 668.9 Ad95
Summary: Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared
List(s) this item appears in: New arrival Aug. 27 to Sep. 02, 2018
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Holdings
Item type Current library Collection Call number Status Date due Barcode Item holds
Books Books PK Kelkar Library, IIT Kanpur General Stacks 668.9 Ad95 (Browse shelf(Opens below)) Available A183731
Total holds: 0

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.

The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.


Reviews the latest research, development and future prospective of polyimides
Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers
Presents a highly organized work that is composed of different sections that are easily compared

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